Chip-on-Wafer and Wafer-on-Wafer for AI


Graphcore produces and sells HW dedicated to AI computing, while TSMC is a leading Fab for semiconductors and leader of edge technologies for their packaging. Those technologies are explained very well in this video. WoW is a new way to make the CPU more efficient and with a higher rate of interconnections between computational units and memories.

Popular posts from this blog

Unlocking Swiss Productivity: Why Moving from ETO/DTO to CTO Can Free Up Millions

The Missing Piece of PLM: Roadmaps and Obsolescence in the B2B Market

Digital Sovereignty in Switzerland: A Pragmatic View for Leaders and Decision Makers